Rainbow-electronics MAX8884Z Uživatelský manuál stáhnout pdf (Strana 2)

MAX8884Y/MAX8884Z

700mA DC-DC Step-Down Converters

with Dual 300mA LDO in 2mm x 2mm CSP

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

IN1A

= V

IN1B

= V

IN2

= V

LDO1_EN

= V

LDO2_EN

= V

BUCK_EN

= 3.6V. T

= -40°C to +85°C, typical values are at T

= +25°C, unless

otherwise noted.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

IN1A, IN1B, IN2, REFBP to AGND ........................-0.3V to +6.0V

FB to PGND ...........................................................-0.3V to +6.0V

SEL, BUCK_EN to AGND...............-0.3V to (V

IN1A

IN1B

+ 0.3V)

LDO1, LDO2, LDO1_EN, LDO2_EN

to AGND.................................................-0.3V to (V

IN2

+ 0.3V)

IN2 to IN1A, IN1B ..................................................-0.3V to +0.3V

AGND to PGND .....................................................-0.3V to +0.3V

IN1A, IN1B, LX Current .....................................................1A

RMS

Continuous Power Dissipation (T

= +70°C)

16-Bump CSP (derate 12.5mW/°C above +70°C) ..............1W

Operating Temperature .......................................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Bump Temperature*.........................................................+260°C

PARAMETER CONDITIONS MIN TYP MAX UNITS

INPUT SUPPLY

Input Voltage V

IN1A

, V

IN1B

, V

IN2

2.7 5.5 V

Input Undervoltage Threshold V

IN1A

, V

IN1B

, V

IN2

rising, 180mV typical hysteresis 2.52 2.63 2.70 V

= +25°C 0.1 4

Shutdown Supply Current

BUCK_EN

= V

LDO1_EN

LDO2_EN

= 0

= +85°C 0.1

μA

BUCK_EN

= 0, I

LDO1

= I

LDO2

= 0A 140 230 μA

No-Load Supply Current

LDO1_EN

= V

LDO2_EN

= 0, I

BUCK

= 0A, no switching 50 80 μA

THERMAL PROTECTION

Thermal Shutdown T

rising, 20°C typical hysteresis +160 °C

LOGIC CONTROL

Logic Input-High Voltage

(BUCK_EN, SEL, LDO1_EN,

LDO2_EN)

2.7V  V

IN1A

= V

IN1B

= V

IN2

 5.5V 1.3 V

Logic Input-Low Voltage

(BUCK_EN, SEL, LDO1_EN,

LDO2_EN)

2.7V  V

IN1A

= V

IN1B

= V

IN2

 5.5V 0.4 V

= +25°C 0.01 1

Logic Input Current (BUCK_EN,

SEL, LDO1_EN, LDO2_EN)

= 0 or V

= V

IN1A

= 5.5V

= +85°C 0.1

μA

SEL = AGND, I

BUCK

= 0A 1.18 1.22 1.24 V

Buck Converter Output Voltage

SEL

= V

IN1A

, I

BUCK

= 0A 1.78 1.80 1.85 V

= +25°C 0.01 1

FB Leakage Current

IN1A

= V

IN1B

= V

IN2

= 5.5V,

= 0

= +85°C 1

μA

p-channel MOSFET switch, I

= -40mA 0.18 0.30

On-Resistance

n-channel MOSFET rectifier, I

= 40mA 0.15 0.25



These ICs are constructed using a unique set of packaging techniques imposing a limit on the thermal profile used during board level

solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification,

JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.

1 2 3 4 5 6 7 ... 14 15

MAX8884Y/MAX8884Z 1

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