MAX5890
14-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= +3.3V, AV
DD1.8
= DV
DD1.8
= +1.8V, external reference V
REFIO
= +1.2V, output load 50Ω double-ter-
minated, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
≥ +25°C are
guaranteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at
T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AV
DD1.8
, DV
DD1.8
to AGND, DGND, DACREF,
and CGND.......................................................-0.3V to +2.16V
AV
DD3.3
, DV
DD3.3
, AV
CLK
to AGND, DGND,
DACREF, and CGND.........................................-0.3V to +3.9V
REFIO, FSADJ to AGND, DACREF,
DGND, and CGND ..........................-0.3V to (AV
DD3.3
+ 0.3V)
OUTP, OUTN to AGND, DGND, DACREF,
and CGND .......................................-1.2V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to AGND, DGND, DACREF,
and CGND..........................................-0.3V to (AV
CLK
+ 0.3V)
PD to AGND, DGND, DACREF,
and CGND.......................................-0.3V to (DV
DD3.3
+ 0.3V)
Digital Data Inputs (D0N–D13N, D0P–D13P) to AGND,
DGND, DACREF, and CGND ..........-0.3V to (DV
DD1.8
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C) (Note 1)
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
Thermal Resistance
θ
JA
(Note 1) ....................................24°C/W
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
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